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Omscientific is a representative of Set in India.

SET - Smart Equipment Technology, is the leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders.


Explore the World of Absolute Bonding Precision

SET, Smart Equipment Technology, is a world leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders. Founded in 1975, SET has pioneered in the development of flip chip bonders for infrared sensors and optoelectronics applications.

With an installed base of more than 300 Device Bonders worldwide, SET is globally renowned for the unsurpassed sub-micron post-bonding accuracy and the flexibility of its systems.

Thanks to several decades of high accuracy placement expertise, SET brings also to the market cutting-edge nanoimprint solutions which offer proven sub-micron alignment capabilities also combined with superior flexibility.


Products:

​​FC300R
FC300
FC150
KADETT
LDP150


Nanoimprinting Tool

NPS300