Omscientific is a representative of Set in India.

NEO HB

With ± 1 µm post-bond accuracy in stand-alone or full automatic mode, the NEO HB is an automatic flip-chip bonder designed for production.


Combining high precision, flexibility and very short cycle time, it is pefectly suitable for hybrid / direct bonding processes (metal-to-metal or oxide-to-oxide), at room temperature and at low bonding force.


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