Om Scientific

OmScientific Private Limited
High tech scientific equipment
solution provider

	Home
	Product Gallery
	Contact Us

Company Profile
Products
Consultancy
News / Events
Careers

PRODUCT LIST : Semiconductor / MEMS / Solar

S.E.T. (Smart Equipment Technology), France

Product: Die bonding, Flip Chip Technology, and Nanoimprint Lithography tools

Suss-Microtec, Germany

Product: Mask Aligner, Spin Coater, Wafer Bonder and Metrology Systems

Semicore Equipment Inc., USA

Product: Sputtering System, PVD Coating System

Protemp Products Inc., USA

Product: Diffusion Furnace Systems, AR Film and POCl3 Deposition Systems, Furnace Heating Elements

Felcon Ltd., United Kingdom

Product: Wet Benches and Process Baths

Dynatex International, USA

Product: Wafer Scriber and Breaker

Hiden Isochema Ltd., United Kingdom

Product: IGA Series (For Gravimetric Analysis) and HTP Series (For Hydrogen Storage Materials)

TPT Wire Bonder Germany

Product: Wire Bonder (Ball & Wedge Bonder)

Company profile ¦ Products ¦ Consultancy ¦ News / Events ¦ Careers ¦ Contact Us

Contact mask aligner ( NXQ 4004 /4006)
Substrate size from pieces to 150 mm diameter Manual X, Y and theta alignment stage Vacuum / Pressure contact exposure modes Optical Splitfield and CCTV microscope options Simple, topside mask loading Low maintenance. Available Options: • Infrared (IR) back side alignment • Large gap alignment • UV / NUV / DUV exposure optics • Carousel load
Features and technical specifications…….

Contact & proximity mask aligner (NXQ 7500M /7500AL)
Multiple contact & proximity exposure modes, Wafer size from pieces to 200 mm diameter, Square substrate up to 7x7 Optical and CCTV splitfield microscope options Simple topside mask loading Manual tray loading feature and Modular design, easily configurable for wide variety of applications with available options: • Robotic autoload handling • Automatic alignment • Optical (OBS) and Infrared (IR) backside alignment • Large gap alignment • UV / NUV / DUV Exposure optics
Features and technical specifications…….

Flood Expose System (NXQ1200)

A unique machine with single and double-sided exposure capability. Designed specifically for single mask level applications and/or gross geometries and non-critical alignment - current applications include power devices, LEDs and MEMs applications. R&D and production applications, Manual loading of substrates, Single-side and double-side exposure capability, and Small pieces to 200 mm diameter substrate size

Available Options:
• CCTV Microscope
• Manual X, Y and theta alignment stage

Features and technical specifications…….

Mirro projection mask aligner (MPA 600)
Projection Alignment - 72 WPH • Temperature Control • Thermal/Pneumatic Distortion Control • 1X Scanning • Mask Changer (Optional) NEUTRONIX combines the expertise of component manufacturing and complete systems knowledge in providing you with the highest quality remanufactured equipment available. • Wafer Sizes: 3" to 6" Semi Spec • Wafer Feed: Dual Cassette, Auto Feeder • Alignment: Manual / Automatic • Resolution: 1.5um CD with Depth-Of-Focus +-6
Features and technical specifications…….

Electron Beam Lithography System
Electron Beam Lithography System Crestec’s EB Lithography System enables small spot size same (2nm) as 100kV tool with enhanced stability. Crestec’s 50kV CABL provide almost all technical specifications and application similar to 100kV EBL system but at much lesser price. Crestec’s CABLprovides High Beam position resolution-0.0012nm minimum address size with FSM. Besides this high resolution CABL also enables to provide ‘real-time’ measurement for long working duration, which stands CABL ahead to other competitors. CABL enables proper Stigmation & Focusing adjustment with Clear SEM. CABL has realized the astonishing stability by the high beam-position stability of <+/-10 nm P-P/10H (+/-30nm/5H in the specification). The system has achieved and demonstrated beam uniformity of <0.2%P-P in the actual measurement values.The growing customers of Crestec has used other manufacturers EBL system previously and has provided valuable comparison of CABL system standards compared to others which can be provided on demand.
Features and technical specifications…….

Electron Beam Lithography System
Electron Beam Lithography System Crestec’s EB Lithography System enables small spot size same (2nm) as 100kV tool with enhanced stability. Crestec’s 50kV CABL provide almost all technical specifications and application similar to 100kV EBL system but at much lesser price. Crestec’s CABLprovides High Beam position resolution-0.0012nm minimum address size with FSM. Besides this high resolution CABL also enables to provide ‘real-time’ measurement for long working duration, which stands CABL ahead to other competitors. CABL enables proper Stigmation & Focusing adjustment with Clear SEM. CABL has realized the astonishing stability by the high beam-position stability of <+/-10 nm P-P/10H (+/-30nm/5H in the specification). The system has achieved and demonstrated beam uniformity of <0.2%P-P in the actual measurement values.The growing customers of Crestec has used other manufacturers EBL system previously and has provided valuable comparison of CABL system standards compared to others which can be provided on demand.
Features and technical specifications…….

Electron Beam Lithography System
Electron Beam Lithography System Crestec’s EB Lithography System enables small spot size same (2nm) as 100kV tool with enhanced stability. Crestec’s 50kV CABL provide almost all technical specifications and application similar to 100kV EBL system but at much lesser price. Crestec’s CABLprovides High Beam position resolution-0.0012nm minimum address size with FSM. Besides this high resolution CABL also enables to provide ‘real-time’ measurement for long working duration, which stands CABL ahead to other competitors. CABL enables proper Stigmation & Focusing adjustment with Clear SEM. CABL has realized the astonishing stability by the high beam-position stability of <+/-10 nm P-P/10H (+/-30nm/5H in the specification). The system has achieved and demonstrated beam uniformity of <0.2%P-P in the actual measurement values.The growing customers of Crestec has used other manufacturers EBL system previously and has provided valuable comparison of CABL system standards compared to others which can be provided on demand.
Features and technical specifications…….

Clean room consumables

- Clean room apparels

- Gloves - Vinyl, Nitrile, Letex

- Lint free wipes

- Clean room mats

- ESD clean room stationary

- UV protection gear - face shield, gloves, apparels.

Features and technical specifications…….

Drying and Fingerprinting
Felcon design and build complete ranges of Forensic Laboratory Equipment used within Forensic Support areas including Downdraft Benches, Fume Cupboards, Staining Sinks, Fingerprint Benches, Evidence Drying Cabinets, Racking, Laminar Flow and more.
Features and technical specifications…….

Chemical Wet Benches
Felcon have been manufacturing wet processing stations to the highest industry standard for 20 years. We continue to supply many of the leading companies in the semiconductor, pharmaceutical and electronics industries. We pride ourselves on fully satisfying our clients needs. Our experienced design and construction team have worked together at our production facility in the United Kingdom to perfect our product range. As the needs of the industry changes our flexibility allows us to keep pace with and maintain the standards of satisfaction experienced by our clients. Wet processing stations feature * Bath heater systems. * Filtered recirculation systems. * Chemical dosing. * Quick dump rinse systems. * 1, 2 and 3 stage weir systems. * Maunfactured to all relevant safety standards. * Laminar flow to class 1. * Fully extracted under bench storage or trolleys
Features and technical specifications…….

Dispensing - Sampling - Charging
With over 30 years experience Felcon Ltd. have a broad understanding of the dust containment performance, operator comfort and environmental standards achieved in our proven downflow booth products. With installations around the world, Felcon Ltd. will undertake your project with commitment and enthusiasm, ensuring completion on time, within budget and to your entire satisfaction.
Features and technical specifications…….

Chemical Distribution Systems
With Felcon, you will benefit from over 20 years experience of supplying process engineering equipment to the semiconductor, pharmaceutical and other cleanroom based industries. Felcon provide state-of-the-art local and centralised chemical distribution systems for organic and inorganic process chemistry with point-of-use purity guarantee. Particle add-on is virtually eliminated by utilising virgin, chemically inert materials with filtration at source and point of use. Felcon systems will satisfy the stringent requirements of VLSI and ULSI applications. System designs are application specific, based on a range of modular units and tailored to meet the performance requirements of each facility. This approach ensures no design compromise and guarantees optimum safety and performance.
Features and technical specifications…….

Fume Cabinets
Felcon and Containment Ltd. manufacture standard and special fume cabinets. Conforming to BS 7258 to suit the needs of a wide variety of industrial and research requirements. Felcon extraction cabinets BS 7258 can contain the following; * Sinks * DI-water * Town water * Gas taps * Electrical outlets * Zone 1 rated * Sliding or Bi-folding visors * Stainless steel and epoxy linings * Swan neck taps * Adjustable exhaust damper
Features and technical specifications…….

Clean room
Our Services * CAD Services * Cleanroom Consultant Services * Cleanroom Planning Guide * Test & Certification Services * Request a Planning Guide Our Products * Positive Air Pressure Cleanroom * Softwall Cleanroom Modules * Cleanroom Walls * Negative Pressure Bio-Safety Cleanrooms * Air Handlers - Cleanroom * Air-Tight Dampers * Medical Bio-Containment Modules * Etc
Features and technical specifications…….

Scanning Probe Microscope (SPM)
Scanning Probe Microscope (SPM) This is a reasonably priced scanning probe microscope- Femtoscan, specifically designed for research applications. The device is designed for viewing nano-scale objects and measuring a wide range of their physical parameters. FemtoScan incorporates more than 50 scanning microscopy methods, enabling capability to carryout investigations in various fields such as nanoscience, physics, chemistry, biology etc. Using Femtoscan, you can modify local properties of your samples. Small size, open architecture, powerful software and the possibility of remote control via internet are efficiently integrated in this instrument.
Features and technical specifications…….

Ultra-low temperature Scanning Probe Microscope :
FemtoScan Cryo is designed for surface morphology studies with ultrahigh resolution in the temperature range 4.2K to 300K. This provides completely new possibilities for investigation in Materials science and biology.
Features and technical specifications…….

Atomic Balance
UniLab is an instrument for extremely precise weighing of individual micro-particles. Furthermore, this device can be applied for the measurement of surface tension in thin films and adsorbed layers.
Features and technical specifications…….

Phase contrast X-ray imaging system

X-AMIN PCX, laboratory scale phase contrast optimised x-ray system for 2D imaging and 3D tomography.

The PCX is the only commercial in-line laboratory scale phase contrast X-ray system available today. A number of source configurations are available providing either 4 micron or 1 micron resolution. Using XRT's patented imaging technology, including an X-ray source of high lateral spacial coherence, proven phase retrieval software and a high resolution large array detector, PCX may be configured to acquire absorption images, phase and absorption images, or images with a very pronounced phase signature. Phase plays a large part in producing images of high contrast - particularly from structures which are weakly absorbing and thus not amenable to imaging by conventional X-ray techniques.

Features and technical specifications…….

Near field Scanning Optical Microscope (NSOM) :

NSOM microscopes employ SPMs precision of piezoelectric raster-scanning together with sharp probes to obtain light optical images at rather better than the usual wavelength-limited resolution. Particular care has to be taken in the fact that the application of this physical principle to different particular problems in solid state or biological applications leads to very different technical solutions from a technological point of view. This is the reason why a universal SNOM instrument does not exist but each one must be tailored with a clear vision of what is going to be the main problem of interest.

TriA-SNOM
An Aperture SNOM microscope, capable of collecting optical signal in reflection, transmission and back-reflection modes. An instrument for surface science, optics and biology researchers who need a basic microscope easily expandable and interfaciable with their scientific equipment.

Mag-SNOM
A microscope operating at He liquid temperature, in presence of magnetic fields up to 1 Tesla. The microscope is designed to be fitted into an OXFORD Cryostat.

Features and technical specifications…….

FC300 High Force Die Bonder / Flip Chip Bonder
The SET's FC300 High Force Device Bonder is a new generation of high accuracy and high force system for populating wafer up to 300 mm. The system is available with Nanoimprinting capabilities. Bonding processes: Die Bonding, Flip Chip Bonding, Mass Reflow, In-Situ Reflow, Fluxless Eutectic Bonding, Thermocompression Bonding, Ultrasonic Bonding, UV-Curing Bonding, Adhesive Bonding, UV-NIL, Hot Embossing Lithography...
Features and technical specifications…….

FC250 Production Die Bonder / Flip Chip Bonder
The SET's FC250 High Accuracy Production Device Bonder offers the most precise (placement at ± 0.5 µm) packaging capability. Bonding processes: Die Bonding, Flip Chip Bonding, Mass Reflow, In-Situ Reflow, Fluxless Eutectic Bonding, Thermocompression Bonding, Ultrasonic Bonding, UV-Curing Bonding, Adhesive Bonding...
Features and technical specifications…….

FC150 Automated Die Bonder / Flip Chip Bonder
With ± 0.5 µm placement and ± 1µm post-bond accuracy, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. Bonding processes: Die Bonding, Flip Chip Bonding, Reflow, Fluxless Eutectic Bonding, Thermocompression Bonding, Ultrasonic Bonding, UV-Curing Bonding, Adhesive Bonding...
Features and technical specifications…….

KADETT High Accuracy Placement and Bonding Platform
The SET KADETT Pick and Place is a high accuracy placement and bonding system enabling the assembly of devices on a wide variety of substrates. Bonging processes: Die Bonding, Flip Chip Bonding, In-Situ Reflow, Thermocompression Bonding, Thermosonic Bonding, UV-Curing Bonding...
Features and technical specifications…….

Sputter System
Models: NSC-2000 PLC controlled table top multi-gun sputtering system NSC-3000 PC controlled table top multi-gun sputtering system NSC-4000 PC controlled, stand-alone multi-gun sputtering system Applications: All types of metal and dielectric coating on wafers, ceramics, glass blanks, and disk heads Optical coatings with ion sources Hard coatings with Pulse DC power supplies Reactive sputtering with RF plasma discharge
Features and technical specifications…….

Plasma Enhanced Chemical Vapor Deposition
Models: NPE-3000 PC controlled table top PECVD system NPE-4000 PC controlled, stand-alone PECVD system Applications Plasma Induced Surface Modifications Plasma Cleaning (NF3) Plasma Reactive Ion Etching Plasma Polymerization Plasma Enhanced Chemical Vapor Deposition (PECVD) SiO2, Si3N4, DLC, and other films
Features and technical specifications…….

THERMAL EVAPORATOR System
Models: NTE-3000 PC controlled table top Thermal Evaporator System NTE-4000 PC controlled stand alone Thermal Evaporator System Features: 70l/sec or 200 l/sec turbomolecular pump and mechanical or dry pump (10-6 Torr) Bell jar or Aluminum chamber 2 kVA SCR controlled Crystal thickness monitor Water cooled dual crucible source Rotating platen (1-3 rpm) Compact footprint 26"x26" Close loop temperature control Max. temp 2000 °C for metals, 800°C for organics PC control with LabVIEWTM software
Features and technical specifications…….

Manual Analytical Probe Station
* Dimension ( W / D / H ) * APS150 : 580mm X 460mm X 700mm * APS200 : 660mm X 660mm X 700mm * Weight ( APS150 / APS200 ) : 60kg / 80kg * Vacuum chuck : Stainless steel ( Thermal chuck option ) * Chuck stage travel : * Quick move ( APS150 / APS200 ) : 150 X 150mm / 200 X 200mm * Fine adjust ( APS150 / APS200 ) :150 X 150mm / 200 X 200mm * Chuck theta : 0 ~ 30 degree ( Fine adjust theta option ) * Chuck up / down : 5mn * Microscope stage travel : 25mm X 25mm * Microscope Z up for objective changer over option * Platen movement : fixed ( moveable option )
Features and technical specifications…….

4" Manual Analytical Probe Station
* Vacuum chuck : 4" Stainless steel * Chuck stage travel : 100mm X 100mm * Chuck theta : 0 ~ 30 degree * Chuck up / down : 5mm * Microscope stage travel : 25mm X 25mm
Features and technical specifications…….

4" Easy Probe Station
* Dimension ( W / D / H ) : 350mm X 350mm X 400mm * Weight : 20kg * Vacuum chuck : 4" Stainless steel ( Gold plating on request ) * Chuck stage travel : 75mm X 75mm * Chuck theta : +/- 30 degree
Features and technical specifications…….

Mini Chabmer Probe Station
* Dimension ( W / D / H ) : 600mm X 500mm X 600mm * Weight : 80kg * Chuck : 6" hot chuck * Temperature : -30 degreeC ~ 200 degreeC * Platen : 500mm moveable * Microscope stage travel : 25mm X 25mm * Chuck stage travel : 150mm X 150mm
Features and technical specifications…….

Four Point Probe
* Dimension ( W / D / H ) : 220mm X 420mm X 250mm * Weight : 20kg * Chuck : 4", 6", 8" dia. POM * Head up / down coarse : 60mm * Head up / down fine : 10mm * Probing Z resolution : 1 Micron * Probe pin spacing : 62.5mil
Features and technical specifications…….

Temperature Four Point
* Dimension ( W / D / H ) : 30mm X 50mm X 20mm * Weight : 25kg * Chuck : Thermal chuck 4", 6", 8" * Chamber : Enclosed stainless steel * Nitrogen purge prevent oxidation
Features and technical specifications…….

3D Optical profilometers (Profilometry)

Optical Profilometry High-light Sub-nanometer resolution Non-contact measurements by optical interferometry with vertical resolution down to 0.1 nm Fast results Full field 3D measurements in just a few seconds Versatile Reflectivity 1% to 100% : Transparent films (Glass), Silicon, Metal Non-contact measurements All measurements are non destrucitive, repeatable and require no sample preparation System stability and linearity Measurement are related to wavelenght. Highly stable metrology thanks to its design including a capacitive sensor feedback loop.

ZOOMSURF 3D	PHOTOMAP 3D	MICROSURF 3D

Features and technical specifications…….

Laser Doppler Vibrometer
The laser doppler vibrometer measure a surface vibration with sub-angstrom resolution and a 2MHz bandwidth. The measurement principle is to detect the frequency shift of the reflected light of a laser beam. Applications are resonant frequencies measurement, damping factors, vibration phase, mode coupling, studies, frequency shift vs temperature or ageing. The measurement system is composed of one electronic module and one optical module. The optical module is available as a stand alone module. A fiber optic output allows measurement in any position of the laser beam. Light is emitted and collected through a small collimator. The laser doppler vibrometer is connected to a computer with a software module allowing broadband analysis of the vibration spectrum (peak detection, quality factors), file input/output, multiple averaging, transient recording. The optical module is also available for integration into the ZoomSurf 3D microscope. The ZoomSurf 3D is a full 3D surface shape and vibration mode shape measurement system. The laser doppler module add highly sensitive frequency response and transient response measurement capability. System operation take advantage of the motorized translation stage and of the high level of automation of the ZoomSurf system.
Features and technical specifications…….

Thermco HTR Diffusion Systems
Tetreon manufactures the full range of 'Thermco' four stack furnaces, suitable for 75-200mm wafer processing utilising the industry leading TMX control system. All major atmospheric and LPCVD processes are supported. We can also provide systems for R&D or production applications where space and footprint is critical. * Models 4500, 4900, 5100 and 5200 standard systems with 3 or 5 zone temperature control, providing a 30" or 40" flat zone * Model 6200 ACFM system with special auto-locating elements and other automation compatible features * Series 4000 & 5000 load stations providing an ultra clean loading environment [class 10] * All major atmospheric and LPCVD processes are supported, and systems can be supplied with process guarantees * Thermco systems are the most widely installed horizontal furnaces for production at 150mm and below, and are used by most major semiconductor manufacturers
Features and technical specifications…….

Semitherm VTP Diffusion Systems
The Semitherm VTP 1500X is an outstanding vertical diffusion system for the processing of wafers up to 200mm: * Process parameters are controlled by a new system developed from the industry leading TMX controller, the de facto standard for horizontal furnace systems * Efficient and robust automation utilising industry standard robotics and a pneumatically operated jar/element lift mechanism * A process tube replacement time of < 15 minutes means the element can remain hot and removes the need for reprofiling * High throughput using three tower load/unload system * Space efficient with a footprint of < 2 square metres, and < 2.8 metres tall * Configurations available for most applications including wet & dry oxidation, anneal, LPCVD, ultra thin gate dialectric, ultra low temp anneal for BEOL, and ultra low temp LCVD
Features and technical specifications…….

F10-AR
Analyze Anti-Reflection Coatings and Hardcoats on Lenses Easily and Affordably The F10-AR is the first instrument designed for simple, affordable testing of ophthalmic anti-reflection coatings. Available at a fraction of the cost of most instruments in use today, it contains several proprietary advances that allow line operators to make conclusive readings in seconds, and with only minutes of training. Minimum, maximum, and average reflectance can be go/no-go tested over any number of user-defined wavelength ranges. A special algorithm allows for the correction of localized reflectance distortions caused by hardcoat layers. Our proprietary AutoBaseline feature results in vastly increased baseline intervals and fives-times better accuracy than other fiber-probe-based reflectance instruments. Hardcoat thickness 0.25-15um can be measured with our optional UPG-F10-AR-HC software upgrade. Hardcoat thickness even in the presence of AR layers are no problem. No Backside Preparation Necessary Our exclusive probe design rejects 98% of backside reflections on substrates 1.5mm thick, and rejects even more on thicker lenses. Like all of our tabletop instruments, the F10-AR connects to the USB port of your Windows computer and sets up in minutes.
Features and technical specifications…….

F10-VC
Measure Reflectance and Transmittance Simultaneously Designed with vacuum coaters in mind, the F10-VC captures reflectance and transmittance spectra with a single mouse click. For a fraction of the price of legacy systems, users can analyze min/max, determine FWHM, and do color analysis. Optional thickness and index-solving modules provide access to all of the analytical power of the Filmetrics F20. Data can be exported and printed easily for fast distribution. A laptop and 2-year warranty are provided with the system, making the F10-VC a complete, turn-key package.
Features and technical specifications…….

F20-XT
Measure films up to 500um thick The Filmetrics F20-XT is optimized to measure thick films. Measuring films greater than 50 microns presents a unique challenge because of the high optical thickness often encountered (optical thickness = physical thickness x index). Some films, such as silicon, also become opaque in the visible wavelengths when thicker than a few microns. To overcome these challenges, the F20-XT, based on the F20-NIR platform, contains a 512-element InGaAs spectrometer. Covering a wavelength range of 1400-1650 nm, this system maintains a 0.5 nm wavelength resolution in the NIR region, enabling it to detect thicker films more effectively than other optical-based systems. Like all of our tabletop instruments, the F20-XT connects to the USB port of your Windows computer and sets up in minutes.
Features and technical specifications…….

F30
The Most Powerful Tool Available forMonitoring Thin-Film Deposition Measure deposition rates, layer thickness, optical constants (n and k), and uniformity of semiconductors and dielectric layers in real-time with the F30 spectral reflectance system. Example Layers MBE and MOCVD: Smooth and translucent, or lightly absorbing films, may be measured. This includes virtually any semiconducting material, from AIGaN to GaInAsP. Benefits » Dramatically improves productivity » Low cost — Can pay for itself in months » Accurate — Measure to better than ±1% » Fast—Measurements in seconds » Non-Invasive — Totally outside of deposition chamber » Easy to use — Intuitive Windows™ software » Turn-key system sets up in minutes Common Optional Accessories » Laptop computer pre-loaded with FILMeasure software » Lens Assemblies
Features and technical specifications…….

F40
Turn Your Microscope into a Thin-Film Measurement Tool The F40 product family is for applications that require a spot size as small as 2.5 microns. For most microscopes the F40 simply attaches to the c-mount adapter, which is the industry standard for video camera mounting. The F40 comes complete with an integrated color video camera that allows exact monitoring of the measurement spot. Thickness and index can be measured in less than a second. Like all of our tabletop instruments, the F40 connects to the USB port of your Windows computer and sets up in minutes. Common Applications » Displays » Stent passivation and drug-delivery coatings » Semiconductors The three different F40 models each cover a different wavelength range. Generally longer wavelengths allow measurement of thicker, rougher, and more opaque films.
Features and technical specifications…….

F42
High-Resolution Thickness Maps of Microscopic Areas The Filmetrics F42 can map the thickness of over one-million points, each with a spot size as small as 3 microns. Using an integrated CCD camera, live video makes it easy to pinpoint exact measurement locations. Once the feature is in the field of view, simply draw a box around it to analyze it. Pixel-Width Spot Size A thickness measurement is made at every single pixel on the screen, yielding spot sizes as small as 3 microns. This allows measurements to be made in even the narrowest of channels and cavities. Mapping Uniformity can be checked on these structures with the F42 system’s mapping capability. With one click, over a million individual thicknesses can be calculated and displayed in an easy-to-read gradient map. Average thickness and other statistics are automatically reported while notifying the user of any out-of-range thickness measurements. Using goodness-of-fit criteria, the features of interest can be mapped while excluding all other areas. Common Applications » Printed Circuit Boards » Semiconductor Fabrication » Liquid Crystal and OLED Displays
Features and technical specifications…….

F50
Automated Mapping for Production Environments The Filmetrics F50 family of products can map film thickness as quickly as two points per second. A motorized R-Theta stage accepts standard and custom chucks for samples as large as 300mm in diameter. Map patterns can be polar, rectangular, or linear, or you can create your own with no limit on the number of measurement points. Dozens of pre-defined map patterns are supplied. The F50 tabletop system connects to the USB port of your Windows computer and can be set up in minutes. The different F50 instruments are distinguished primarily by wavelength range. The standard F50 is the most popular. Generally shorter wavelengths (e.g. F50-UV) are required for thinner films, while longer wavelengths allow measurement of thicker, rougher, and more opaque films.
Features and technical specifications…….

F60-t
Automated Mapping for Production Environments The Filmetrics F60-t family maps film thickness and index just like our F50 products, but it also includes a number of features intended specifically for production environments. These include automatic notch finding, automatic on-board baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and the option to upgrade to fully robotic wafer handling. The different F60-t instruments are distinguished primarily by wavelength range. Generally shorter wavelengths (e.g. F60-t-UV) are required for thinner films, while longer wavelengths allow measurement of thicker, rougher, and more opaque films.
Features and technical specifications…….

F80-t
Product-Wafer Metrology Made Affordable Process engineers want film thickness measurements fast and without a lot of hassle. Our innovative Thickness Imaging™ technology allows Filmetrics to offer easy recipe set up, industry-leading throughput, and all at a mere fraction of the cost of competing metrology tools. Unlike conventional metrology tools which measure the thickness at a single spot, the F80 quickly generates a thickness image by collecting thousands of thickness readings in the vicinity of the measurement location. This revolutionary innovation results in... » Ultra-Fast Measurements - As Fast As 15 points in 21 seconds » Superior Ease of Use » More Robust Automation » Lower Cost than the Competitors Configurations available from low-cost, manual load Table Top Systems to BOLTS Integrated Metrology Modules to fully automated Standalone Cassette-to-Cassette Systems If you are searching for the next generation in thickness metrology, then look no further than the Filmetrics F80. The F80 is the tool CMP, CVD, PVD and Wafer Track Process Engineers have been waiting for.
Features and technical specifications…….

F80-c
Product-Wafer Metrology Made Affordable Process engineers want film thickness measurements fast and without a lot of hassle. Our innovative Thickness ImagingTM technology allows Filmetrics to offer easy recipe set up, industry-leading throughput, and all at a mere fraction of the cost of competing metrology tools. Unlike conventional metrology tools which measure the thickness at a single spot, the F80 quickly generates a thickness image by collecting thousands of thickness readings in the vicinity of the measurement location. This revolutionary innovation results in... » Ultra-Fast Measurements - As Fast As 15 points in 21 seconds » Superior Ease of Use » More Robust Automation » Lower Cost than the Competitors Configurations available from low-cost, manual load Table Top Systems to BOLTS Integrated Metrology Modules to fully automated Standalone Cassette-to-Cassette Systems If you are searching for the next generation in thickness metrology, then look no further than the Filmetrics F80. The F80 is the tool CMP, CVD, PVD and Wafer Track Process Engineers have been waiting for.
Features and technical specifications…….

F80-a
Product-Wafer Metrology Combined With Wafer-Transfer in One Affordable Tool Available exclusively through our partner Ricmar, the F80-a integrates full F80 functionality with Ricmar’s WTT 300 Wafer Transfer Tool. The result is dual-purpose functionality in a single affordable EFEM platform. Click here to read more about the F80-a on Ricmar’s site.
Features and technical specifications…….