Dynatex International has been the leader in dry process dicing and wafer dicing materials since 1958. Dynatex International is committed to provide solutions for die/diode dicing and wafer processing applications — solutions designed to increase yields, maximize throughput, and minimize operator intervention.


With their five decades of experience, Dynatex offers a strong base of technical accomplishment and business expertise to assist you with your specific product requirements. Dynatex provides a complete line of die singulation products for dry process dicing,wafer bonding and saw dicing systems. These products are productivity enhancement tools for dicing silicon, gallium arsenide, thin film heads, flat panel displays, solid state lasers and other materials or products.


Diamond Scriber and Breaker: