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High precision production and R&D tool
Integrated vision system provides simple (“fire and forget”) automatic processing operations
User friendly GUI with touch screen operation for ease of operator interface
Dynatex International has a 40 year history in dry process die singulation and is the leader in high-precision diamond scribe and break systems. The DTX is the latest entry into Dynatex International’s line of patented integrated die singulation tools.
Applications
The DTX provides processing for GaAs, InP and GaN photonic and optical devices, Laser Diodes, Si MEMS devices with delicate topside structures, Bio-chips, etc.
Features
- High throughput for GaAs, InP, GaN Dry process is ideal for MEMS processing.
- Cleaving of mirror facets for edge emitting laser diodes
- Chipping of laser bars to die (Multiple Bar Matrix process)
DTX Hardware Specifications
Platform
Process Module
Software
Facilities
Although the information and recommendations set forth herein are presented in good faith and believed to be correct, Dynatex International makes no representations as to their completeness or accuracy. Information is supplied upon the condition that the persons receiving will make their own verification and determination as to its suitability for their purposes prior to use. In no event will Dynatex International be responsible for damages of any nature whatsoever resulting from the use of or reliance upon this information. NO REPRESENTATION OR WARRANTIES, EITHER EXPRESSED OR IMPLIED, OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR ANY OTHER NATURE ARE MADE HEREUNDER WITH RESPECT TO INFORMATION OR PRODUCT TO WHICH INFORMATION REFERS.
DTX – Diamond Scribe & Breaker
Omscientific is a representative of Dynatex in India.