Easy reactor cleaning

Regular reactor cleaning is essential for stable and repeatable atomic layer deposition processing. The reactor chamber is easily opened with the help of a lifting device for cleaning.

Glove box system integration

SENTECH atomic layer deposition systems are compatible with glove boxes of various suppliers.

Cluster integration

Atomic layer deposition systems are available as modules for SENTECH clusters. ALD can be combined with SENTECH PECVD and etching systems for industrial application. Clusters optionally feature cassette-to-cassette loading.

SENTECH atomic layer deposition systems enable thermal and plasma enhanced operation. The ALD systems can be configured for oxide, nitride, and metal deposition. 3D structures can be homogenously and conformally coated. With ALD, PECVD and ICPECVD, SENTECH offers plasma deposition technology for depositing films from the nanometer scale up to several microns.

SENTECH ALD systems allow the combination of different thermal and/or plasma enhanced ALD films to multilayer structures. Thermal and plasma enhanced atomic layer deposition is supported in one reactor with an optimal shutter.

SENTECH offers leading edge ultra-fast in-situ monitoring of layer-by-layer film growth using the ALD Real Time Monitor as well as wide range spectroscopic ellipsometry.

Benefits of SENTECH ALD systems:

PEALD for sensitive substrates

The true remote plasma source enables homogenous and conformal coating of sensitive substrates and layers at low temperature <100°C. A high flux of reactive gas species is provided at the sample surface without UV radiation or ion bombardment.

In situ diagnostics for process development and optimization

In situ diagnostic by the ALD Real Time Monitor enables ultra-high resolution of single ALD cycles. The advantages are confirmation of ALD regime, reduction of process time, and total cost of ownership. Spectroscopic ellipsometry, QCM and QMS are provided as in situ diagnostic, too.

Atomic Layer Deposition Systems

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Endpoint detection

The ALD Real Time Monitor features endpoint detection of the ALD deposition with sub Angstrom precession.

Easy operation

One software enables easy operation of SENTECH ALD systems and ALD Real Time Monitor. The ALD Real Time Monitor is fully integrated into SENTECH ALD systems software ensuring easy operation.

The SENTECH ALD Real Time Monitor is a novel optical diagnostic tool allowing ultra-high resolution of single ALD cycles. Analyzing of film properties (growth rate, thickness, refractive index) without breaking the vacuum, developing new processes in short time, and studying reaction mechanisms during ALD cycles in real time are main applications of SENTECH ALD Real Time Monitor.

The innovative ALD Real Time Monitor is especially designed for fast and efficient process development and optimization with SENTECH Atomic layer deposition systems. The software implementation into the ALD control software allows optimal end point detection using the ALD Real Time Monitor.

Benefits of ALD Real Time Monitor:

Efficient process development and optimization

ALD processes are easily and fast developed and optimized using the ALD Real Time Monitor. The ALD Real Time Monitor reveals adsorption and desorption with ultra-high, 40ms time resolution. Developing time, substrates, precursors, and gasses are saved.

In situ monitoring ALD Real Time Monitor